Thermal stress analysis of half-Heusler thermoelectric module by 3D finite element model and orthogonal tests--中国科学院上海硅酸盐研究所

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论文题目:

Thermal stress analysis of half-Heusler thermoelectric module by 3D finite element model and orthogonal tests

作者:

Zhang, Pengxin; Lu, Yanyan; Song, Qingfeng; Wang, Chao; Zou, Peng; Chen, Lidong; Wang, Wenzhi; Bai, Shengqiang

刊物名称:

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

发表年度:

2025

卷:

期:

页码:

2422-2429