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Ultrasonic Semiconductor Thin-Die Bonding Platform

发布时间: 2009-07-14 13:53 | 【 【打印】【关闭】
SEMINAR
Information Materials and Devices Research Center
Shanghai Institute of Ceramics, Chinese Academy of Sciences
 
 
Ultrasonic Semiconductor Thin-Die Bonding Platform
 
 
Speaker
Prof. Derek Siu-wing Or
 
 
Department of Electrical Engineering,  The Hong Kong Polytechnic University
 
 
 
时间: 6 月 5 日 (星期五)下午 13:30
地点: 2 号楼 607会议室
联系人:罗豪甦 李国荣研究员
 
Abstract
The continual evolution of electronic products towards multi-functionality and miniaturization has pressed the manufacturing journey of the electronics industry in the direction of higher density, higher performance, higher flexibility, smaller size, and lower cost. The significant reduction in thickness of semiconductor dies from 500 to 25 μm in the recent years not only represents a revolutionary breakthrough in semiconductor technology, but also creates a great tendency towards the major format of semiconductor packages and their resulting electronic products. We have recently developed a novel ultrasonic technological platform consisting of a critical ultrasonic bonding device, a sustainable automated manufacturing equipment, and a green process to enable room-temperature and rapid bonding of semiconductor thin-dies onto various substrates. State-of-the-art thermo-compression thin-die bonding equipment and process suffer intrinsically from high process temperature (120–160 ºC), long process time (3–10 s), single die bonding per process cycle, continual heating of fresh and post-bonded dies and substrates, and limited bondable substrates. The project was won a Gold Award in the 37th International Exhibition of Inventions, New Techniques and Products of Geneva, Switzerland in April 2009.
 
 
Education          
Sep 97 – Mar 01  PhD Degree in Engineering Physics (Part Time)
The Hong Kong Polytechnic University
Thesis Title: High Frequency Transducer for Ultrasonic Bonding
               Thesis Advisor: Professor Helen Lai Wa Chan
Jul 95 – Jun 97  MPhil Degree in Engineering Physics (Teaching Company Scheme)
The Hong Kong Polytechnic University
Thesis Title: Performance Study of the Ultrasonic Wire Bonder Used in
Microelectronics Packaging
Thesis Advisor: Professor Helen Lai Wa Chan
Sep 92 – Jun 95  BSc Degree in Engineering Physics with First Class Honors (Ranked No. 1)
The Hong Kong Polytechnic University
Dissertation Title: Piezoelectric Polymer Acoustic Sensors
 
Experience       
Since Jul 08    Associate Professor
Department of Electrical Engineering, The Hong Kong Polytechnic University
 
May 05 – Jun 08  Assistant Professor
 
Sep 02 – Apr 05  Lecturer
Department of Applied Physics, The Hong Kong Polytechnic University
 
Since Jun 03    Consultant
ASM Assembly Automation Ltd., Hong Kong
(The world’s largest assembly and packaging equipment supplier for the semiconductor industry)
Apr 02 – Aug 01   Postdoctoral Research Fellow
Mechanical and Aerospace Engineering Department, University of California, LosAngeles (UCLA), USA
Jan 01 –Jul 99    R&D Project Team Leader and Senior R&D Electronic Engineer
ASM Assembly Automation Ltd., Hong Kong
Honors and Awards
Apr 09   Gold award  the 37th International Exhibition of Inventions,New Techniques and Products of Geneva, Switzerland
May 08  Guest Professor Shanghai Institute of Ceramics, Chinese Academy of Sciences. (2008-)
 
Feb 08   Outstanding Professional Services and Innovation Awards 2007 – International Award
The Hong Kong Polytechnic University
Award-Winning Project: Self-Sustainable Magnetoelectric Smart Sensors
Jan 07   Outstanding Professional Services and Innovation Awards 2006 – International Award
The Hong Kong Polytechnic University
Award-Winning Project: Smart Vibration Damping System for Intelligent Vibration
Control of Civil and Mechanical Structures
Jan 07  Outstanding Professional Services and Innovation Awards 2006 – International Award The Hong Kong Polytechnic University
Award-Winning Project: Advanced Composite Materials for Integrated Circuits and Microelectronics Wire Bonders
Dec 06  The President’s Award for Excellent Performance / Achievement – Research and
Scholarly Activities 2005/06 The Hong Kong Polytechnic University
Nov 06  Bronze Award
International Trade Fair for “Ideen–Erfindungen–Neuheiten” 2006 (IENA2006)
(Ideas–Inventions–Innovations) Nuremberg, Germany, 2–5 November 2006
Award-Winning Project: Self-Sustainable Magnetoelectric Smart Sensors
May 06  The Faculty Award for Outstanding Performance / Achievement – Research and
Scholarly Activities 2005/06 The Hong Kong Polytechnic University
Sep 05  Silver Medal (銀獎)
The 15th National Exhibition of Inventions
Beijing, China, 12–15 September 2005
Award-Winning Project: Smart Vibration Damping System for Intelligent Vibration
Control of Civil and Mechanical Structures)
Sep 05  Silver Medal (銀獎)
The 15th National Exhibition of Inventions (第十五屆中國全國發明展覽會)
Beijing, China, 12–15 September 2005
Award-Winning Project: Advanced Composite Materials for Integrated Circuits and Microelectronics Wire Bonders
Jul 03   Visiting Research Assistant Professor
Mechanical and Aerospace Engineering Department, UCLA, USA
Dec 02  Gold Award
The Seoul International Invention Fair 2002,Coex, Korea, 4–8 December 2002
Award-Winning Project: Advanced Composite Materials for IC and Microelectronic Wire Bonders