SEMINAR
　　The Key Lab of Inorganic Functional Materials and Devices
　　Shanghai Institute of Ceramics, Chinese Academy of Sciences
　　中 国 科 学 院 上 海 硅 酸 盐 研 究 所 无 机 功 能 材 料 与 器 件 重 点 实 验 室

　　Microwave & millimetre-wave device technologies based on multi-layer structures 

　　Speaker

　　Dr. Yi Wang 

　　University of Greenwich, U.K  

　　时间：7月24日(星期四) 上午9：30 

　　地点：四号楼14楼第2会议室

　　联系人：  刘志甫 (52411042)

　　Abstract

　　In high-frequency electronics, multi-layer structures are widely used for vertical circuit integration as well as for the formation of miniature 3D transmission structures. This talk will focus on the emerging multi-layer device technologies for microwave and millimetre-wave applications. We will first look at a multi-layer micromachining technique used to fabricate 3D guided and free-space circuits. We will then look at three competing vertical integration techniques – low-temperature co-fired ceramics (LTCC), liquid crystal polymers (LCP) and photoimageable thick films.   

　　Biography of Dr. Yi Wang 

　　Dr Yi Wang received his BSc and MSc degrees in Physics and Ph.D. in Electronic Engineering from the University of Birmingham, U.K. He had worked at Birmingham as a Research Fellow for six years before joining University of Greenwich, U.K. as a Senior Lecturer in 2011. He is a Senior Member of IEEE. His main research interests are emerging microwave and millimetre-wave device technologies based on novel materials (e.g. superconductors, ferroelectrics, meta-materials) and advanced fabrication process (e.g. micromachining, MEMS). His minor interests are microwave measurements and material characterizations.